Fostering New Trends In MMIC Design

Infrastructure

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Aelius Semiconductors' team of MMIC design engineers carries a combined 70+ man years of dedicated MMIC design experience. Each engineer works with industry standard MMIC CAD software that includes circuit simulators like Agilent ADS, AWR Microwave Office along with ADS momentum, MWO Axiem and Sonnet for EM simulation. In addition, they have access to other higher end software for 3D EM simulation. The former Microelectronic Technologies Division of AMPL which grew to be India's largest and best equipped GaAs MMIC design and production house, has been spun off to Aelius Semiconductors Pte Ltd, Singapore.

Aelius has a fully equipped state-of-the-art assembly, test and packaging facility which includes its own RF on-wafer probing test and measurement facility for optimizing designs to various foundry processes. On-wafer RF probing provides an excellent platform to validate and fine tune designs.

This division has access to the largest Space Qualified MMIC assembly and test facility in India. Packaging of MMICs is also undertaken as per customer requirement. Using the in-house facility, Ceramic and hermetically sealed packaged MMICs can be delivered. For Hermetically sealed packages, gross and fine leak test can be conducted as required. Our Environmental test facility is capable of carrying out MIL grade, Jedec as well as IEC compliant qualification tests including Temperature-cycling, Burn-in, Mechanical Shock test, vibration test on all three axes, and thermo-vacuum tests.

MMIC design and manufacturing

  • State of the art tools like Microwave Office/Advanced Design System (ADS)
  • Class 10000 and class 100000 clean rooms
  • Class 100 laminar flow benches
  • Complete ESD care
  • Temperature/humidity-controlled desiccators with nitrogen purging for bare chips storage
  • Humidity/temperature-controlled bonded material store
  • Fume absorbers with soldering stations to avoid contamination
  • Dicing system for cutting alumina substrate, and GaAS/GaN/silicon wafer
  • Resistive welding system for package sealing

Equipment

  • Semi-Automatic and Manual on-wafer probe stations
  • Scalar and vector network analyzers
  • Noise figure analyzers
  • Microwave frequency counters
  • Power meters
  • Signal generators
  • Function and pulse generators
  • Open air antenna test range
  • High-precision bonding machines
  • Temperature controlled hot plate with nitrogen purging facility for eutectic attachment
  • Clean room compatible oven for curing epoxy 
  • X10-X100 magnification microscopes
  • Thermosonic wire bonders for deep access ball and wedge bonding Parallel gap welding

ESS equipment

  • Temperature/humidity/particle count measurement equipment
  • 100X-500X magnification inspection microscope
  • Testers for bond pull and die sheer strength
  • DC probing station for on-chip measurement of DC parameters
  • Environment chambers (-65 celsius to +175 celsius; 98% RH)
  • Vibration equipment for sine, random, sine over random
  • Gross leak and fine leak detectors for hermetic verification of packages